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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16470070
Filing Dt:
06/14/2019
Publication #:
Pub Dt:
03/12/2020
Inventors:
Yuichi Yokoyama, Youji Kawahara, Yuji Saito
Title:
HEAT DISSIPATION MODULE
Assignment: 1
Reel/Frame:
049497/0636Recorded: 06/18/2019Pages: 7
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/27/2019
Exec Dt:
02/27/2019
Exec Dt:
02/23/2019
Assignee:
5-1, KIBA 1-CHOME, KOTO-KU
TOKYO, JAPAN 135-8512
Correspondent:
YUICHI WATANABE
909 FANNIN, SUITE 3500
HOUSTON, TX 77010

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