Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16469638
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Filing Dt:
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06/13/2019
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Publication #:
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Pub Dt:
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03/12/2020
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Inventors:
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XIANG MA, PAUL R LALINDE, BAOSHENG ZHANG, JAMIL A WAKIL
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Title:
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THERMAL MODULES WITH CONDUCTIVE COVER PLATES
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11445 COMPAQ CENTER DRIVE WEST |
| HOUSTON, TEXAS 77070 |
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| HP INC. |
| 3390 E. HARMONY ROAD MS 35 |
| INTELLECTUAL PROPERTY |
| FORT COLLINS, CO 80528 |
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