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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/29/2022
Application #:
16609743
Filing Dt:
10/31/2019
Publication #:
Pub Dt:
03/12/2020
Inventors:
Jingchun CHU, Ling YUAN, Lei PAN, Wenchao CHEN, Chong JIAO, Fa XIE, Wen DU, Yanping LI et al
Title:
SIMULATION EVALUATION MODEL OF HIGH VOLTAGE RIDE THROUGH CAPABILITY, SIMULATION EVALUATION METHOD BASED ON THE SAME AND STORAGE MEDIUM
Assignment: 1
Reel/Frame:
050898/0473Recorded: 11/03/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/26/2019
Exec Dt:
09/26/2019
Exec Dt:
09/26/2019
Exec Dt:
09/26/2019
Exec Dt:
09/26/2019
Exec Dt:
09/26/2019
Exec Dt:
09/26/2019
Exec Dt:
09/26/2019
Exec Dt:
09/26/2019
Exec Dt:
09/26/2019
Exec Dt:
09/26/2019
Assignee:
BUILDING 1, YARD 16, W. 4TH RING RD., HAIDIAN DIST. BEIJING 100039, CN
BEIJING, CHINA 100039
Correspondent:
GOKALP BAYRAMOGLU
1540 W. WARM SPRINGS ROAD SUITE 100
HENDERSON, NV 89014

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