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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/05/2022
Application #:
16681556
Filing Dt:
11/12/2019
Publication #:
Pub Dt:
03/12/2020
Inventors:
Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang, Chin-Szu Lee et al
Title:
Dielectric Film for Semiconductor Fabrication
Assignment: 1
Reel/Frame:
050986/0358Recorded: 11/12/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/28/2016
Exec Dt:
09/28/2016
Exec Dt:
09/30/2016
Exec Dt:
09/28/2016
Exec Dt:
09/28/2016
Exec Dt:
09/28/2016
Exec Dt:
10/12/2016
Assignee:
8, LI-HSIN RD. 6
HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
HAYNES AND BOONE, LLP (24061) IP SECTION
2323 VICTORY AVENUE
SUITE 700
DALLAS, TX 75219

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