Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/26/2021
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Application #:
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16203053
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Filing Dt:
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11/28/2018
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Publication #:
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Pub Dt:
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03/12/2020
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Inventors:
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Yong Hoon KIM, Jin Won LEE, Doo Hwan LEE, Tae Je CHO
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Title:
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SUBSTRATE HAVING EMBEDDED INTERCONNECT STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| MAEYOUNG-RO 150 (MAETAN-DONG), YOUNGTONG-GU |
| SUWON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITOL STREET, N.W. |
| WASHINGTON, DC 20001 |
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