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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
16691875
Filing Dt:
11/22/2019
Publication #:
Pub Dt:
03/19/2020
Inventors:
Kenji Matsuda, Ai Takamori, Tadashi Hayakawa
Title:
Moisture-Curable Hot-Melt Adhesive Agent
Assignment: 1
Reel/Frame:
052681/0601Recorded: 05/18/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/09/2017
Exec Dt:
05/07/2017
Exec Dt:
05/08/2017
Assignee:
2-2-8 HIGASHI SHINAGAWA
SHINAGAWA-KU
TOKYO, JAPAN 140-0002
Correspondent:
HENKEL CORPORATION
ONE HENKEL WAY
ROCKY HILL, CT 06067
Assignment: 2
Reel/Frame:
052681/0659Recorded: 05/18/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/13/2018
Assignee:
HENKELSTRASSE 67
DUESSELDORF, GERMANY 40589
Correspondent:
HENKEL CORPORATION
ONE HENKEL WAY
ROCKY HILL, CT 06067

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