Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16693960
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Filing Dt:
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11/25/2019
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Publication #:
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Pub Dt:
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03/19/2020
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Inventors:
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Sa Yong LEE, Yong Il KWON, Jin Ho HONG, Sung Han KIM, Keun Yong LEE
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Title:
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MAGNETIC SUBSTRATE AND METHOD OF MANUFACTURING THE SAME, BONDING STRUCTURE BETWEEN MAGNETIC SUBSTRATE AND INSULATING MATERIAL, AND CHIP COMPONENT HAVING THE BONDING STRUCTURE
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Assignment:
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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MAEYOUNG-RO 150 (MAETAN-DONG), YEONGTONG-GU, GYEONGGI-DO |
SUWON-SI, KOREA, REPUBLIC OF |
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NSIP LAW |
P.O. BOX 65745 |
WASHINGTON, DC 20035 |
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