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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/06/2021
Application #:
16570061
Filing Dt:
09/13/2019
Publication #:
Pub Dt:
03/19/2020
Inventor:
Kenji YAMASHITA
Title:
WAFER SURFACE BEVELING METHOD, METHOD OF MANUFACTURING WAFER, AND WAFER
Assignment: 1
Reel/Frame:
050368/0532Recorded: 09/13/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
09/12/2019
Assignee:
2-1, SHIBAURA 1-CHOME, MINATO-KU
TOKYO, JAPAN 1058634
Correspondent:
GREENBLUM & BERNSTEIN, P.L.C.
1950 ROLAND CLARKE PLACE
RESTON, VA 20191

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