Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/06/2021
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Application #:
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16321682
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Filing Dt:
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01/29/2019
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Publication #:
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Pub Dt:
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03/19/2020
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Inventors:
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Yuying GAO, Wei WEI
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Title:
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DE-BONDING LEVELING DEVICE AND DE-BONDING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1525 ZHANGDONG ROAD, ZHANGJIANG HIGH-TECH PARK |
| SHANGHAI, CHINA 201203 |
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| MUNCY, GEISSLER, OLDS & LOWE, PC |
| 4000 LEGATO RD., SUITE 310 |
| FAIRFAX, VA 22033 |
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