Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/31/2021
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Application #:
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16419672
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Filing Dt:
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05/22/2019
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Publication #:
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Pub Dt:
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03/19/2020
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Inventors:
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Tung-Liang SHAO, Chung-Jung WU, Chen-Hua YU, Jen-Yu WANG, Chih-Hang TUNG
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Title:
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SEMICONDUCTOR PACKAGE WITH COMPOSITE THERMAL INTERFACE MATERIAL STRUCTURE AND METHOD OF FORMING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| BIRCH, STEWART, KOLASCH & BIRCH, LLP. |
| 8110 GATEHOUSE ROAD, SUITE 100E |
| FALLS CHURCH, VA 22040-0747 |
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