Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/02/2021
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Application #:
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16140883
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Filing Dt:
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09/25/2018
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Publication #:
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Pub Dt:
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03/26/2020
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Inventors:
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Yves Martin, Tymon Barwicz
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Title:
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Solder-Pinning Metal Pads for Electronic Components
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| MICHAEL J. CHANG |
| 84 SUMMIT AVENUE |
| MICHAEL J. CHANG, LLC |
| MILFORD, CT 06460 |
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