Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/04/2023
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Application #:
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16576700
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Filing Dt:
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09/19/2019
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Publication #:
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Pub Dt:
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04/02/2020
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Inventors:
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Isao SAKAMOTO, Hiroaki TANIGUCHI, Akira KITAMURA
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Title:
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MOLDED SOLDER AND MOLDED SOLDER PRODUCTION METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-19-43, HIGASHI-OIZUMI, NERIMA-KU |
| TOKYO, JAPAN 178-8511 |
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| MORI & WARD, LLP |
| 2000 DUKE STREET |
| SUITE 300 |
| ALEXANDRIA, VA 22314 |
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