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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
05/21/2024
Application #:
16587546
Filing Dt:
09/30/2019
Publication #:
Pub Dt:
04/02/2020
Inventors:
Lei Liu, Jiwang Jin, WenYu Liu, Hongqiang Han, Yan Lee, Zhicheng Li
Title:
Heat Sink And Housing Assembly
Assignment: 1
Reel/Frame:
050564/0952Recorded: 09/30/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/18/2019
Exec Dt:
09/18/2019
Exec Dt:
09/18/2019
Exec Dt:
09/18/2019
Exec Dt:
09/18/2019
Exec Dt:
09/19/2019
Assignee:
SECTIONS F, G AND H, LEVEL 1, BUILDING 15
NO. 999 YINGLUN ROAD, CHINA (SHANGHAI) PILOT FREE TRADE ZONE
SHANGHAI, CHINA
Correspondent:
BARLEY SNYDER
2 GREAT VALLEY PARKWAY
SUITE 110
MALVERN, PA 19355

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