Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/01/2022
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Application #:
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16714721
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Filing Dt:
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12/14/2019
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Publication #:
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Pub Dt:
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04/16/2020
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Inventors:
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Jun CAI, Wei LING
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Title:
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FINGERPRINT MODULE AND PREPARATION METHOD THEREOF, AND ELECTRONIC DEVICE AND PREPARATION METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| FLOOR 13, PHASE B, TENGFEI INDUSTRIAL BUILDING |
| FUTIAN FREE TRADE ZONE |
| SHENZHEN, CHINA 518045 |
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| FIRSTIPR |
| 3905 HEDGCOXE RD |
| UNIT# 251207 |
| PLANO, TX 75025 |
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