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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11032454
Issue Dt:
06/08/2021
Application #:
16472032
Filing Dt:
06/20/2019
Publication #:
20200120244
Pub Dt:
04/16/2020
Inventors:
Mingzhu WANG, Zhenyu CHEN, Nan GUO, Yafei WANG, Bojie ZHAO, Duanliang CHENG et al
Title:
CIRCUIT BOARD, MOLDED PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR, PHOTOGRAPHING MODULE, AND ELECTRONIC DEVICE
Assignment: 1
Reel/Frame:
049548/0745Recorded: 06/21/2019Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
WANG, MINGZHU
Exec Dt:
06/07/2019
CHEN, ZHENYU
Exec Dt:
06/17/2019
CHENG, DUANLIANG
Exec Dt:
06/11/2019
TANAKA, TAKEHIKO
Exec Dt:
06/10/2019
ZHAO, BOJIE
Exec Dt:
06/11/2019
GUO, NAN
Exec Dt:
06/18/2019
WANG, YAFEI
Exec Dt:
06/16/2019
Assignee:
NINGBO SUNNY OPOTECH CO., LTD.
66-68 SHUNYU ROAD, YUYAO CITY
NINGBO, ZHEJIANG, CHINA 315400
Correspondent:
SUGHRUE MION, PLLC
2000 PENNSYLVANIA AVENUE, N.W.
SUITE 900
WASHINGTON, DC 20006-1812

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