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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
04/19/2022
Application #:
16710022
Filing Dt:
12/11/2019
Publication #:
Pub Dt:
04/16/2020
Inventor:
Takafumi KUSUYAMA
Title:
CIRCUIT BOARD, CIRCUIT MODULE, METHOD OF MANUFACTURING CIRCUIT BOARD, AND METHOD OF MANUFACTURING CIRCUIT MODULE
Assignment: 1
Reel/Frame:
051245/0024Recorded: 12/11/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
11/19/2019
Assignee:
10-1, HIGASHIKOTARI 1-CHOME, NAGAOKAKYO-SHI
KYOTO, JAPAN 617-8555
Correspondent:
PEARNE & GORDON LLP
1801 EAST 9TH STREET
SUITE 1200
CLEVELAND, OH 44114-3108

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