Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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11/16/2021
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Application #:
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16553949
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Filing Dt:
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08/28/2019
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Publication #:
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Pub Dt:
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04/23/2020
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Inventor:
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Tatsuya KARASAWA
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Title:
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SEMICONDUCTOR DEVICE HAVING CASE TO WHICH CIRCUIT BOARD IS BONDED BY BONDING MATERIAL AND METHOD OF MANAFACTURING THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, TANABESHINDEN, KAWASAKI-KU |
| KAWASAKI-SHI, KANAGAWA, JAPAN 210-9530 |
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| RABIN & BERDO, P.C. |
| 1101 14TH ST., N.W., SUITE 500 |
| WASHINGTON, DC 20005 |
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