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Patent Assignment Abstract of Title

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Total Assignments: 2

Patent #:	10910466	Issue Dt:	02/02/2021	Application #:	16289831	Filing Dt:	03/01/2019
Publication #:	20200127078	Pub Dt:	04/23/2020
Inventors:	Cheng Jen Lin, Ming-Da Cheng, Chun Kai Tzeng, Yung-Ching Chao, Mirng-Ji Lii
Title:	Process for Tuning Via Profile in Dielectric Material

Assignment: 1

Reel/Frame:

048476/0819

Recorded: 03/01/2019

Pages: 4

Conveyance:

ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).

Assignors:

TZENG, CHUN KAI

Exec Dt:

02/18/2019

JEN, LIN CHENG

Exec Dt:

02/20/2019

CHAO, YUNG-CHING

Exec Dt:

02/20/2019

CHENG, MING-DA

Exec Dt:

02/18/2019

LII, MIRNG-JI

Exec Dt:

02/18/2019

Assignee:

TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.

8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK

HSINCHU, TAIWAN 300-78

Correspondent:

SLATER MATSIL, LLP

17950 PRESTON RD., SUITE 1000

DALLAS, TX 75252

Assignment: 2

Reel/Frame:

054209/0512

Recorded: 10/26/2020

Pages: 6

Conveyance:

CORRECTIVE ASSIGNMENT TO CORRECT THE TYPOGRAPHICAL ERROR IN 2ND INVENTOR'S NAME PREVIOUSLY RECORDED ON REEL 048476 FRAME 0819. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT OF ASSIGNOR'S INTEREST.

Assignors:

TZENG, CHUN KAI

Exec Dt:

10/19/2020