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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/16/2021
Application #:
16605275
Filing Dt:
10/15/2019
Publication #:
Pub Dt:
04/23/2020
Inventor:
Hideyuki Wada
Title:
MULTILAYER SUBSTRATE, MULTILAYER SUBSTRATE ARRAY, AND TRANSMISSION/ RECEPTION MODULE
Assignment: 1
Reel/Frame:
050716/0511Recorded: 10/15/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/29/2019
Assignee:
1-5-1, KIBA, KOTO-KU
TOKYO, JAPAN 1358512
Correspondent:
WESTERMAN, HATTORI, DANIELS & ADRIAN, LLP
8500 LEESBURG PIKE
SUITE 7500
TYSON, VA 22182

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