Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/12/2022
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Application #:
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16442235
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Filing Dt:
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06/14/2019
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Publication #:
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Pub Dt:
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04/30/2020
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Inventors:
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Tsung-Sheng KUO, Hsu-Shui LIU, Jiun-Rong PAI, Yang-Ann CHU, Chieh-Chun LIN, Shine CHEN
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Title:
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INTEGRATED SEMICONDUCTOR DIE PARCELING PLATFORMS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN ROAD 6, HSINCHU SCIENCE PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| DUANE MORRIS LLP (TSMC) - IP DEPARTMENT |
| 30 SOUTH 17TH STREET |
| PHILADELPHIA, 19103 UNITED STATES |
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