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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
12/15/2020
Application #:
16176116
Filing Dt:
10/31/2018
Publication #:
Pub Dt:
04/30/2020
Inventors:
Yu-Lien Huang, Peng Wang
Title:
Method for Shrinking Openings in Forming Integrated Circuits
Assignment: 1
Reel/Frame:
047424/0850Recorded: 11/06/2018Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/31/2018
Exec Dt:
10/31/2018
Assignee:
8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK
HSINCHU, TAIWAN 300-78
Correspondent:
SLATER MATSIL, LLP
17950 PRESTON RD., SUITE 1000
DALLAS, TX 75252

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