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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
16659716
Filing Dt:
10/22/2019
Publication #:
Pub Dt:
04/30/2020
Inventors:
Chu-Chin Hu, Che-Wei Hsu, Shih-Ping Hsu
Title:
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD OF MAKING THE SAME
Assignment: 1
Reel/Frame:
050785/0907Recorded: 10/22/2019Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
10/17/2019
Exec Dt:
10/18/2019
Exec Dt:
10/18/2019
Assignee:
NO.458-17, XINXING RD., HUKOU TOWNSHIP
HSINCHU COUNTY, TAIWAN 30353
Correspondent:
MCCLURE, QUALEY & RODACK, LLP
280 INTERSTATE NORTH CIRCLE SE
SUITE 550
ATLANTA, GA 30339

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