Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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07/11/2023
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Application #:
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16727779
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Filing Dt:
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12/26/2019
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Publication #:
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Pub Dt:
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04/30/2020
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Inventors:
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Hui Jae YOO, Huseyin Ekin SUMBUL, Gregory K. CHEN, Abhishek SHARMA, Van H. LE, Phil KNAG et al
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Title:
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MULTI-CHIP MODULE HAVING A STACKED LOGIC CHIP AND MEMORY STACK
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
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| COMPASS IP LAW PC |
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| PORTLAND, OR 97229 |
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