Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16494402
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Filing Dt:
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09/16/2019
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Publication #:
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Pub Dt:
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05/07/2020
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Inventors:
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Tetsuro Nishimura, Takatoshi Nishimura, Tetsuya Akaiwa, Shoichi Suenaga
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Title:
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Soldered Joint
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 16-15, ESAKACHO 1-CHOME |
| SUITA-SHI, OSAKA, JAPAN 564-0063 |
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| BOZICEVIC, FIELD & FRANCIS LLP |
| 201 REDWOOD SHORES PARKWAY |
| SUITE 200 |
| REDWOOD CITY, CA 94065 |
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