Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/24/2021
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Application #:
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16542087
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Filing Dt:
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08/15/2019
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Publication #:
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Pub Dt:
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05/07/2020
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Inventors:
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Wen-Chuan WANG, Cheng-Chi WU
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Title:
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WAFER-TO-DESIGN IMAGE ANALYSIS (WDIA) SYSTEM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN RD. 6, SCIENCE BASED INDUSTRIAL PARK |
| HSINCHU, TAIWAN 300 |
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| MCDERMOTT WILL & EMERY LLP |
| THE MCDERMOTT BUILDING |
| 500 NORTH CAPITAL STREET, N.W. |
| WASHINGTON, DC 20001 |
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