Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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09/07/2021
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Application #:
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16777371
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Filing Dt:
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01/30/2020
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Publication #:
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Pub Dt:
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05/28/2020
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Inventors:
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Tetsuo INOUE, Takashi HINO, Shuichi SAITO
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Title:
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COMPONENT AND SEMICONDUCTOR MANUFACTURING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, SHIBAURA 1-CHOME, MINATO-KU |
| TOKYO, JAPAN 105-8001 |
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| 8, SHINSUGITA-CHO, ISOGO-KU, YOKOHAMA-SHI |
| KANAGAWA-KEN, JAPAN 235-8522 |
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| HARNESS DICKEY & PIERCE, PLC |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 8, SHINSUGITA-CHO, ISOGO-KU, YOKOHAMA-SHI |
| KANAGAWA-KEN, JAPAN 235-8522 |
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| HARNESS, DICKEY & PIERCE, PLC |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6, TAKEDA TOBADONO-CHO, FUSHIMI-KU, KYOTO-SHI |
| KYOTO, JAPAN 612-8501 |
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| HARNESS, DICKEY & PIERCE, PLC |
| P.O. BOX 828 |
| BLOOMFIELD HILLS, MI 48303 |
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