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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
11300456
Issue Dt:
04/12/2022
Application #:
16685643
Filing Dt:
11/15/2019
Publication #:
20200166413
Pub Dt:
05/28/2020
Inventors:
Akihiro OSAKA, Hideto YAMAGUCHI, Tetsuya KOSUGI, Tokunobu AKAO, Atsushi UMEKAWA et al
Title:
SUBSTRATE PROCESSING APPARATUS, AND THERMOCOUPLE
Assignment: 1
Reel/Frame:
058360/0130Recorded: 12/10/2021Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
OSAKA, AKIHIRO
Exec Dt:
02/19/2016
KOSUGI, TETSUYA
Exec Dt:
02/19/2016
AKAO, TOKUNOBU
Exec Dt:
02/19/2016
UMEKAWA, ATSUSHI
Exec Dt:
03/01/2016
TAKEWAKI, MOTOYA
Exec Dt:
02/19/2016
YAMAGUCHI, HIDETO
Exec Dt:
02/19/2016
Assignee:
HITACHI KOKUSAI ELECTRIC INC.
14-1, SOTOKANDA 4-CHOME, CHIYODA-KU
TOKYO, JAPAN 101-8980
Correspondent:
VOLPE KOENIG
30 SOUTH 17TH STREET, 18TH FLOOR
PHILADELPHIA, NJ 19103
Assignment: 2
Reel/Frame:
058360/0205Recorded: 12/10/2021Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HITACHI KOKUSAI ELECTRIC INC.
Exec Dt:
12/05/2018
Assignee:
KOKUSAI ELECTRIC CORPORATION
3-4, KANDAKAJI-CHO, CHIYODA-KU
TOKYO, JAPAN 101-0045
Correspondent:
VOLPE KOENIG
30 SOUTH 17TH STREET, 18TH FLOOR
PHILADELPHIA, PA 19103

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