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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
01/19/2021
Application #:
16572621
Filing Dt:
09/17/2019
Publication #:
Pub Dt:
05/28/2020
Inventors:
Yun Hwa CHOI, Young hun KIM, Tae Heon LEE, JEONG HUN CHO
Title:
MULTILAYER CLIP STRUCTURE ATTACHED TO A CHIP
Assignment: 1
Reel/Frame:
050394/0178Recorded: 09/17/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/11/2019
Exec Dt:
09/11/2019
Exec Dt:
09/11/2019
Exec Dt:
09/11/2019
Assignee:
102, GILJU-RO 425BEON-GIL
BUCHEON-SI, GYEONGGI-DO, KOREA, REPUBLIC OF 14487
Correspondent:
PARK, KIM & SUH, LLC
1875 CENTURY PARK EAST
SUITE #600
LOS ANGELES, CA 90067

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