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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
11/10/2020
Application #:
16782587
Filing Dt:
02/05/2020
Publication #:
Pub Dt:
06/04/2020
Inventors:
Jeffrey Kapec, Yukiko Naoi, German Eduardo Jurado Rivera, Darrin Friend, Morris Jacobs et al
Title:
IMPLANT PACKAGING ASSEMBLY
Assignment: 1
Reel/Frame:
064401/0369Recorded: 07/27/2023Pages: 16
Conveyance:
SECURITY INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/30/2023
Assignee:
ONE M&T PLAZA
BUFFALO, NEW YORK 14203
Correspondent:
ALLEN N. HANSEN III
120 ALBANY STREET PLAZA
NEW BRUNSWICK, NJ 08901

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