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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11162191
Issue Dt:
11/02/2021
Application #:
16305680
Filing Dt:
11/29/2018
Publication #:
20200181802
Pub Dt:
06/11/2020
Inventors:
Susumu MAEDA, Haruo SUDO, Koji ARAKI, Kozo NAKAMURA, Hironori BANBA, Hideyuki OKAMURA et al
Title:
THERMAL PROCESSING METHOD FOR SILICON WAFER
Assignment: 1
Reel/Frame:
047626/0461Recorded: 11/29/2018Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MAEDA, SUSUMU
Exec Dt:
11/05/2018
BANBA, HIRONORI
Exec Dt:
11/05/2018
SUDO, HARUO
Exec Dt:
11/05/2018
OKAMURA, HIDEYUKI
Exec Dt:
11/09/2018
ARAKI, KOJI
Exec Dt:
11/05/2018
SUEOKA, KOJI
Exec Dt:
11/13/2018
NAKAMURA, KOZO
Exec Dt:
11/10/2018
Assignee:
GLOBALWAFERS JAPAN CO., LTD.
6-861-5, SEIRO-MACHI HIGASHIKO, KITAKANBARA-GUN
NIIGATA, JAPAN
Correspondent:
WENDEROTH, LIND & PONACK, L.L.P.
1030 15TH STREET NW
SUITE 400 EAST
WASHINGTON, DC 20005

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