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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11037814
Issue Dt:
06/15/2021
Application #:
16704369
Filing Dt:
12/05/2019
Publication #:
20200185253
Pub Dt:
06/11/2020
Inventors:
Shigenori HARADA, Hayato KIUCHI, Taro ARAKAWA, Emiko KAWAMURA, Toshiki MIYAI et al
Title:
WAFER PROCESSING METHOD USING A RING FRAME WITH A POLYESTER SHEET WITH NO ADHESIVE LAYER
Assignment: 1
Reel/Frame:
051190/0837Recorded: 12/05/2019Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
HARADA, SHIGENORI
Exec Dt:
11/18/2019
MATSUZAWA, MINORU
Exec Dt:
11/13/2019
KIUCHI, HAYATO
Exec Dt:
11/13/2019
YODO, YOSHIAKI
Exec Dt:
11/14/2019
ARAKAWA, TARO
Exec Dt:
11/13/2019
AGARI, MASAMITSU
Exec Dt:
11/13/2019
KAWAMURA, EMIKO
Exec Dt:
11/13/2019
FUJII, YUSUKE
Exec Dt:
11/13/2019
MIYAI, TOSHIKI
Exec Dt:
11/13/2019
OHMAE, MAKIKO
Exec Dt:
11/13/2019
Assignee:
DISCO CORPORATION
13-11, OMORI-KITA 2-CHOME, OTA-KU,
TOKYO, JAPAN 143-8580
Correspondent:
GREER, BURNS & CRAIN, LTD
300 S. WACKER DR.
SUITE 2500
CHICAGO, IL 60606

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