Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/26/2021
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Application #:
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16257021
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Filing Dt:
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01/24/2019
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Publication #:
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Pub Dt:
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06/11/2020
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Inventor:
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Shing-Yih SHIH
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Title:
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METHOD OF FORMING FINE INTERCONNECTION FOR A SEMICONDUCTOR DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.98, NANLIN RD., TAISHAN DIST. |
| NEW TAIPEI CITY, TAIWAN 243 |
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| CKC & PARTNERS CO., LLC |
| 12345 LAKE CITY WAY NE, NO. 283 |
| SEATTLE, WA 98125 |
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