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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
03/07/2023
Application #:
16642396
Filing Dt:
02/27/2020
Publication #:
Pub Dt:
06/18/2020
Inventors:
Artem BORISKIN, Ray KEATING, Justin CUNNINGHAM
Title:
ADHESIVE-FREE BONDING OF DIELECTRIC MATERIALS, USING NANOJET MICROSTRUCTURES
Assignment: 1
Reel/Frame:
052424/0078Recorded: 04/17/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/24/2020
Exec Dt:
02/19/2020
Exec Dt:
02/21/2020
Assignee:
975 AVENUE DES CHAMPS-BLANCS
CESSON-SEVIGNE, FRANCE 35576
Correspondent:
VINCENT DUFFY
19868 COLLINS RD
CANYON COUNTRY, CA 91351
Assignment: 2
Reel/Frame:
062417/0833Recorded: 01/19/2023Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
02/24/2020
Exec Dt:
02/19/2020
Exec Dt:
02/21/2020
Assignee:
975 AVENUE DES CHAMPS-BLANCS
CS17616
CESSON-SEVIGNE, FRANCE 35576
Correspondent:
MICHAEL A. PUGEL
20925 CREEK RD
NOBLESVILLE, IN 46060

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