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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10832912
Issue Dt:
11/10/2020
Application #:
16730220
Filing Dt:
12/30/2019
Publication #:
20200194262
Pub Dt:
06/18/2020
Inventors:
Javier A. DELACRUZ, Steven L. TEIG, Shaowu HUANG, William C. PLANTS, David Edward FISCH
Title:
DIRECT-BONDED NATIVE INTERCONNECTS AND ACTIVE BASE DIE
Assignment: 1
Reel/Frame:
051568/0937Recorded: 01/21/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
DELACRUZ, JAVIER A.
Exec Dt:
10/27/2017
TEIG, STEVEN L.
Exec Dt:
10/27/2017
HUANG, SHAOWU
Exec Dt:
10/27/2017
PLANTS, WILLIAM C.
Exec Dt:
10/27/2017
FISCH, DAVID EDWARD
Exec Dt:
10/26/2017
Assignee:
INVENSAS BONDING TECHNOLOGIES, INC.
3025 ORCHARD PKWY
SAN JOSE, CALIFORNIA 95134
Correspondent:
XPERI CORPORATION
3025 ORCHARD PARKWAY
SAN JOSE, CA 95134
Assignment: 2
Reel/Frame:
051569/0032Recorded: 01/21/2020Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INVENSAS BONDING TECHNOLOGIES, INC.
Exec Dt:
03/22/2018
Assignee:
XCELSIS CORPORATION
3025 ORCHARD PARKWAY
SAN JOSE, CALIFORNIA 95134
Correspondent:
XPERI CORPORATION
3025 ORCHARD PARKWAY
SAN JOSE, CA 95134

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