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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
Issue Dt:
11/01/2022
Application #:
16693736
Filing Dt:
11/25/2019
Publication #:
Pub Dt:
06/25/2020
Inventors:
Tsuyoshi TAMOGAMI, Yoshio Yoshida, Tadashi Hayakawa
Title:
AQUEOUS BONDING COMPOSITION
Assignment: 1
Reel/Frame:
061419/0429Recorded: 09/13/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/22/2017
Exec Dt:
05/22/2017
Exec Dt:
05/22/2017
Assignee:
2-2-8 HIGASHI SHINAGAWA, SHINAGAWA-KU
TOYKO, JAPAN 140-002
Correspondent:
HENKEL CORPORATION
ONE HENKEL WAY
ROCKY HILL, CT 06067
Assignment: 2
Reel/Frame:
061073/0192Recorded: 09/13/2022Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/25/2019
Assignee:
HENKELSTRASSE 67
DUESSELDORF, GERMANY 40589
Correspondent:
HENKEL CORPORATION
ONE HENKEL WAY
ROCKY HILL, CT 06067

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