Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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01/12/2021
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Application #:
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16229562
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Filing Dt:
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12/21/2018
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Publication #:
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Pub Dt:
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06/25/2020
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Inventors:
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Hung-Hsin Hsu, Yuan-Fu Lan, Hsien-Wen Hsu, Ming-Chih Chen
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Title:
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STACKED PACKAGE STRUCTURE WITH ENCAPSULATION AND REDISTRIBUTION LAYER AND FABRICATING METHOD THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO.10, DATONG RD. |
HUKOU TOWNSHIP, HSINCHU COUNTY, TAIWAN 30352 |
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PATENTTM.US |
P. O. BOX 82788 |
PORTLAND, OR 97282-0788 |
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