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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11332486
Issue Dt:
05/17/2022
Application #:
16564125
Filing Dt:
09/09/2019
Publication #:
20200207790
Pub Dt:
07/02/2020
Inventors:
Gyu-Hee Park, Takanori Koide, Yoshiki Manabe, Masayuki Kimura, Akio Saito, Jaesoon Lim et al
Title:
ALUMINUM COMPOUND AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME
Assignment: 1
Reel/Frame:
050311/0314Recorded: 09/09/2019Pages: 14
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
PARK, GYU-HEE
Exec Dt:
05/24/2019
KOIDE, TAKANORI
Exec Dt:
05/29/2019
MANABE, YOSHIKI
Exec Dt:
05/29/2019
KIMURA, MASAYUKI
Exec Dt:
05/29/2019
SAITO, AKIO
Exec Dt:
05/27/2019
LIM, JAESOON
Exec Dt:
05/24/2019
CHO, YOUNJOUNG
Exec Dt:
05/24/2019
Assignees:
SAMSUNG ELECTRONICS CO., LTD.
129, SAMSUNG-RO, YEONGTONG-GU, GYEONGGI-DO
SUWON-SI, KOREA, REPUBLIC OF 16677
ADEKA CORPORATION
116-8554 7-2-35 HIGASHI-OGU ARAKAWAKU
TOKYO, JAPAN
Correspondent:
SUGHRUE MION, PLLC.
2000 PENNSYLVANIA AVE., NW.
8TH FLOOR
WASHINGTON, DC 20006

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