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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
16816108
Filing Dt:
03/11/2020
Publication #:
Pub Dt:
07/02/2020
Inventors:
Feng WANG, Wanjun CHEN, Su-Hui LIN, Ling-Yuan HONG, Quan LIN, Yu ZHAN, Chen-Ke HSU
Title:
DIE BONDING PROCESS FOR MANUFACTURING SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE MANUFACTURED THEREBY
Assignment: 1
Reel/Frame:
052100/0696Recorded: 03/12/2020Pages: 16
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Assignee:
NO. 841-899, MIN AN ROA, HONGTANG TOWN, TONGAN DISTRICT
XIAMEN, FUJIAN, CHINA
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, P.C.
4000 LEGATO ROAD
SUITE 310
FAIRFAX, VA 22033
Assignment: 2
Reel/Frame:
052664/0942Recorded: 05/14/2020Pages: 17
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE RECEIVING PARTY ADDRESS PREVIOUSLY RECORDED AT REEL: 52100 FRAME: 696. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
Assignors:
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Exec Dt:
03/02/2020
Assignee:
NO. 841-899, MIN AN ROAD
HONGTANG TOWN, TONGAN DISTRICT XIAMEN
FUJIAN, CHINA
Correspondent:
MUNCY, GEISSLER, OLDS & LOWE, PC
4000 LEGATO RD., SUITE 310
FAIRFAX, VA 22033

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