Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/17/2021
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Application #:
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16406600
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Filing Dt:
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05/08/2019
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Publication #:
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Pub Dt:
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07/02/2020
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Inventors:
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Techi WONG, Po-Yao CHUANG, Shin-Puu JENG, Yi-Wen WU, Po-Hao TSAI, Shih-Ting HUNG
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Title:
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SEMICONDUCTOR PACKAGE WITH IMPROVED INTERPOSER STRUCTURE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| BIRCH STEWART KOLASCH & BIRCH LLP |
| 8110 GATEHOUSE ROAD SUITE 100E |
| FALLS CHURCH, VA 22042 |
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