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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
08/31/2021
Application #:
16721980
Filing Dt:
12/20/2019
Publication #:
Pub Dt:
07/02/2020
Inventors:
Tatsuya Hayashi, Masahito Naito
Title:
STACK-TYPE WIRE MOUNT WAFER CONNECTOR AND CONNECTOR ASSEMBLY
Assignment: 1
Reel/Frame:
051339/0860Recorded: 12/20/2019Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/15/2019
Exec Dt:
11/15/2019
Assignee:
P.O. BOX 33427
SAINT PAUL, MINNESOTA 55133-3427
Correspondent:
3M INNOVATIVE PROPERTIES COMPANY
PO BOX 33427
ST. PAUL, MN 55133-3427

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