Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16817894
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Filing Dt:
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03/13/2020
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Publication #:
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Pub Dt:
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07/09/2020
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Inventors:
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Keiji FUKUSHIMA, Yuji HOTTA, Daisuke SHIMAMOTO, Shihui SONG, Yoshitaka TAKEZAWA et al
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Title:
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COMPLEX OF LAMELLAR INORGANIC COMPOUND AND ORGANIC COMPOUND AND METHOD OF PRODUCING THEREOF, DELAMINATED LAMELLAR INORGANIC COMPOUND AND METHOD OF PRODUCING THEREOF, INSULATING RESIN COMPOSITION, RESIN SHEET, INSULATOR, RESIN SHEET CURED PRODUCT, AND HEAT DISSIPATING MEMBER
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9-2, MARUNOUCHI 1-CHOME |
| CHIYODA-KU, |
| TOKYO, JAPAN 100-6606 |
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| 3-1, KASUMIGASEKI 1-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-8921 |
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| ALAN E. SCHIAVELLI |
| 1250 23RD STREET NW, SUITE 410 |
| WASHINGTON, DC 20037-1164 |
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