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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
11649355
Issue Dt:
05/16/2023
Application #:
16608649
Filing Dt:
03/27/2020
Publication #:
20200224030
Pub Dt:
07/16/2020
Inventors:
Qing GONG, Wei ZHOU, Xiong ZHANG, Yue YU, Renlan SHI
Title:
LOW-DIELECTRIC RESIN COMPOSITION, LOW-DIELECTRIC RESIN/METAL COMPOSITE MATERIAL AND PREPARATION METHOD THEREOF, AND ELECTRONIC EQUIPMENT
Assignment: 1
Reel/Frame:
050831/0852Recorded: 10/25/2019Pages: 5
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
GONG, QING
Exec Dt:
10/18/2019
ZHOU, WEI
Exec Dt:
10/10/2019
ZHANG, XIONG
Exec Dt:
10/09/2019
YU, YUE
Exec Dt:
10/08/2019
SHI, RENLAN
Exec Dt:
10/09/2019
Assignee:
BYD COMPANY LIMITED
NO. 3009, BYD ROAD
PINGSHAN
SHENZHEN, GUANGDONG, CHINA 518118
Correspondent:
CALFEE, HALTER & GRISWOLD LLP
THE CALFEE BUILDING
1405 EAST SIXTH STREET
CLEVELAND, OH 44114-1607

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