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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
10861719
Issue Dt:
12/08/2020
Application #:
16831620
Filing Dt:
03/26/2020
Publication #:
20200227284
Pub Dt:
07/16/2020
Inventors:
David Mui, Butch Berney, Alois Goller, Michael Ravkin
Title:
METHOD AND APPARATUS FOR PROCESSING WAFER-SHAPED ARTICLES
Assignment: 1
Reel/Frame:
052240/0214Recorded: 03/26/2020Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
MUI, DAVID
Exec Dt:
03/16/2016
BERNEY, BUTCH
Exec Dt:
03/16/2016
GOLLER, ALOIS
Exec Dt:
03/18/2016
RAVKIN, MIKE
Exec Dt:
03/16/2016
Assignee:
LAM RESEARCH CORPORATION
4650 CUSHING PARKWAY
FREMONT, CALIFORNIA 94538
Correspondent:
SCHWEGMAN LUNDBERG & WOESSNER, P.A.
PO BOX 2938
MINNEAPOLIS, MN 55402
Assignment: 2
Reel/Frame:
054344/0245Recorded: 11/06/2020Pages: 5
Conveyance:
CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE FROM LAM RESEARCH CORPORATION TO LAM RESEARCH AG AS PREVIOUSLY RECORDED ON REEL 052240 FRAME 0214. ASSIGNOR(S) HEREBY CONFIRMS THE FILING OF THE ASSIGNMENT.
Assignors:
MUI, DAVID
Exec Dt:
03/16/2016
BERNEY, BUTCH
Exec Dt:
03/16/2016
GOLLER, ALOIS
Exec Dt:
03/18/2016
RAVKIN, MICHAEL
Exec Dt:
03/16/2016
Assignee:
LAM RESEARCH AG
SEZ-STRASSE 1
VILLACH, AUSTRIA 9500
Correspondent:
SCHWEGMAN LUNDBERG & WOESSNER P.A.
PO BOX 2938
MINNEAPOLIS, MN 55402

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