Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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04/12/2022
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Application #:
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16641221
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Filing Dt:
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02/21/2020
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Publication #:
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Pub Dt:
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07/16/2020
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Inventors:
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Bin Liu, Zhicheng Ding, Zhijun Xu, Yong She
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Title:
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POWER ENHANCED STACKED CHIP SCALE PACKAGE SOLUTION WITH INTEGRATED DIE ATTACH FILM
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2200 MISSION COLLEGE BLVD. |
| SANTA CLARA, CALIFORNIA 95054 |
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| GREEN, HOWARD, & MUGHAL LLP. |
| 5 CENTERPOINTE DRIVE |
| SUITE 400 |
| LAKE OSWEGO, OR 97035 |
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