Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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12/22/2020
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Application #:
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16486140
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Filing Dt:
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08/14/2019
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Publication #:
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Pub Dt:
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07/23/2020
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Inventors:
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Toshinori OGASHIWA, Yuya SASAKI, Masayuki MIYAIRI, Kenichi INOUE
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Title:
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STRUCTURE AND METHOD FOR SEALING THROUGH-HOLE, AND TRANSFER SUBSTRATE FOR SEALING THROUGH-HOLE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 7-3, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-6422 |
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| MICHAEL D. KAMINSKI |
| FOLEY & LARDNER LLP |
| 3000 K STREET, N.W., SUITE 600 |
| WASHINGTON, DC 20007 |
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