Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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16251481
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Filing Dt:
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01/18/2019
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Publication #:
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Pub Dt:
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07/23/2020
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Inventors:
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Runsheng Mao, Ning-Cheng Lee
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Title:
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LEAD-FREE SOLDER PASTE FOR THERMAL VIA FILLING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 111 BUSINESS PARK DRIVE |
| UTICA, NEW YORK 13502 |
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| SHEPPARD, MULLIN, RICHTER & HAMPTON LLP |
| 650 TOWN CENTER DRIVE |
| 4TH FLOOR |
| COSTA MESA, CA 92626 |
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