Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
05/10/2022
|
Application #:
|
16737083
|
Filing Dt:
|
01/08/2020
|
|
Publication #:
|
|
Pub Dt:
|
07/30/2020
| | | | |
|
Inventors:
|
Xiaobo Shi, Krishna P. Murella, Joseph D. Rose, Hongjun Zhou, Mark Leonard O'Neill
|
|
Title:
|
Shallow Trench Isolation (STI) Chemical Mechanical Planarization (CMP) Polishing With Low Abrasive Concentration And A Combination Of Chemical Additives
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 8555 SOUTH RIVER PARKWAY |
| PATENT DEPT. |
| TEMPE, ARIZONA 85284 |
|
|
|
|
| LISA HOFFMANN |
| 7350 TILGHMAN STREET, SUITE 104 |
| PATENT DEPT. |
| ALLENTOWN, PA 18106-9000 |
|
|
Search Results as of:
05/11/2024 12:33 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
