Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
|
Issue Dt:
|
03/07/2023
|
Application #:
|
16753184
|
Filing Dt:
|
04/02/2020
|
|
Publication #:
|
|
Pub Dt:
|
07/30/2020
| | | | |
|
Inventors:
|
Keisuke KAWASHIMA, Takashi ODA, Koji INOUE
|
|
Title:
|
RESIN MATERIAL FOR FORMING UNDERLAYER FILM, RESIST UNDERLAYER FILM, METHOD OF PRODUCING RESIST UNDERLAYER FILM, AND LAMINATE
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 5-2, HIGASHI-SHIMBASHI 1-CHOME |
| MINATO-KU, TOKYO, JAPAN 105-7122 |
|
|
|
|
| BUCHANAN INGERSOLL & ROONEY PC |
| P.O. BOX 1404 |
| ALEXANDRIA, VA 22314-1404 |
|
|
Search Results as of:
05/14/2024 05:16 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
