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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
03/16/2021
Application #:
16852527
Filing Dt:
04/19/2020
Publication #:
Pub Dt:
08/06/2020
Inventors:
Payam Rabiei, Jamie Nam, Amir Torkaman, Seyfollah Toroghi
Title:
Apparatus For Bonding Wafers and an Optically-Transparent Thin Film Made from the Same
Assignment: 1
Reel/Frame:
052436/0204Recorded: 04/19/2020Pages: 6
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/19/2020
Exec Dt:
04/19/2020
Exec Dt:
04/19/2020
Exec Dt:
04/19/2020
Assignee:
1487 POINSETTIA AVE., STE 119
VISTA, CALIFORNIA 92081
Correspondent:
INVENT CAPTURE, LLC.
39675 CEDAR BLVD., STE 170
NEWARK, CA 94560

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