Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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02/15/2022
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Application #:
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16852987
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Filing Dt:
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04/20/2020
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Publication #:
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Pub Dt:
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08/06/2020
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Inventors:
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Chen-Hua Yu, An-Jhih Su, Chi-Hsi Wu, Der-Chyang Yeh, Ming Shih Yeh, Jing-Cheng Lin et al
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Title:
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Raised Via for Terminal Connections on Different Planes
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Assignment:
1
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CORRECTIVE ASSIGNMENT TO CORRECT THE CORRECT THE 7TH INVENTORS NAME PREVIOUSLY RECORDED AT REEL: 042883 FRAME: 0665. ASSIGNOR(S) HEREBY CONFIRMS THE ASSIGNMENT.
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8, LI-HSIN RD. 6, HSINCHU SCIENCE PARK |
HSINCHU, TAIWAN 300-78 |
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SLATER MATSIL, LLP |
17950 PRESTON RD., SUITE 1000 |
DALLAS, TX 75252 |
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05/15/2024 01:58 AM
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